With the increasing trend of intelligent electronic products, such as more and more electronic components in cars, mobile phones, and smart homes, and increasingly harsh application environments, semiconductor product design engineers need to consider various factors such as space and performance. The product not only has low power consumption, but also has a smaller package size as an ideal electronic component. The D2PAK packaged electronic components fully meet these requirements. The chip lead frame is not only small in area, but also has a very thin thickness. During the packaging process, the lead frame needs to be turned around, and a high-precision aluminum alloy case is used for the turnover transportation.