The die bond is also known as Die Bond or film. The fixed crystal unit bonds the wafer to a designated area of the support through a colloid (typically a conductive adhesive or an insulating glue for the LED) to form a heat path or an electrical path, and provides a conditional process for the subsequent wire bonding. At this time, we need to use our expansion ring. It is divided into an inner ring and an outer ring. The two are grouped together and used mainly for diffusion wafers.