Packaging Printing Residue Test Gas Chromatography Testing Machine Migration Measurement

Product Detail                                                                                                         

Application:

GC-7960 Ethylene Oxide Residue Tester applies to test of solvent residue on various printing films, laminated films, extrusion films, various drug-use films and sheets as well as various kinds of sterilization apparatus and instruments. It is one highly cost-effective tester and SYSTESTER launched GC-7960 specially for food & pharmaceutical industries, quality inspection departments as well as research and development institutions.

Packaging Printing Residue Test Gas Chromatography Testing Machine Migration Measurement

Characteristics:   

1. Professionally ethylene oxide residue test.

2. Microcomputer controls, LCD displays.

3. PVC keyboard, easy to operate.

4. Dual CPUs design, excellent electromagnetic interference protection.

5. Dual FID detectors, dual gas circuits system, self-diagnosis function.

6. Ignite automatically.

7. Constant and programming temperature control function.

8. Temperature control accuracy over 0.1°C.

9. 8 grades temperature programming function.(Personal customization available)

10. Temperature rising fast, highly efficient capillary column, zero-dead volume.

11. Bigger oven design.

12. Variable frequency cooling system, easy to do a nearest room temperature test.

13. Record parameters automatically even power’s down.

14. Over temperature protection function.

15. Carrier gas flow monitoring to protect TCD detector and oven column.

16. Self-diagnosis function, trouble is easy to resolve.

17. Powerful chromatographic work station.

Packaging Printing Residue Test Gas Chromatography Testing Machine Migration Measurement

Indexes

1. Temperature Control:

   Oven: room temperature +8~ 420°C, accuracy ±0.1°C (at 200°C)

   Injector: room temperature +8~ 420°C, accuracy ±0.1°C (at 200°C)

   Detector: room temperature +8~420°C, accuracy ±0.1°C (at 200°C)

2. Oven:

Temperature Control: room temperature +8~420°C, accuracy ±0.1°C (at 200°C)

Dimension: 280mm X 280mm X 250mm

Programmed Temperature: 8 grades. (Personal customization available)

Programmed Temperature rising rate: 1°C ~50°C

Dwell time at One Grade: 0~300min

3. FID Detector:

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