Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding
USD $1 - $2 /Piece
Min.Order:1 Piece
Vitrified bond suitable for silicon wafer back grinding wheel
Diamond back grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on Japanese, Korean grinders with high performance.
Silicon back grinding wheel has the following features:
1. High efficiency
2. Sharp grinding
3. Long life span
4. Good surface quality
5. High cost performance
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer, gallium arsenide and GaN wafer.
Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.
Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.
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The Specification Of Diamond Back Grinding Wheels:
Model | Diameter (Mm) | Thickness (Mm) | Hole (Mm) |
6A2 | 175 | 30, 35 | 76 |
200 | 35 | 76 | |
350 | 45 | 127 | |
6A2T | 195 | 22.5, 25 | 170 |
280 | 30 | 228.6 | |
6A2T(Three Ellipses) | 350 | 35 | 235 |
209 | 22.5 | 158 | |
Other Size Can Ba Made According To Customers Requirements Email: @Moresuperhard.Com |
silicon wafer back grinding wheel features:
1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;
2, processing accuracy: TTV<5 μm etc. (Total thinning veracity);
3, processing quality: surface roughness:<10 nm; damage layer thickness: <10 μm;
Application of back grinding wheel
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
The LED substrate thinning grinding wheel is mainly used for the back surface thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and gallium nitride wafer in the LED industry. The grinding LED substrate grinding wheel developed by our company has superior grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines, and can replace imported products.
If you need any products, do not hesitate to contact
Annamoresupe@gmail.com
Anna.wang@moresuperhard.com
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