Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding
Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding
Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding
Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding
Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding

Silicon Wafer Back Grinding Wheel at Rs 20000 /piece Wheels For Wafer Back Grinding

USD $1 - $2 /Piece

Min.Order:1 Piece

Supply Ability:
3000 Piece / Pieces per Month
Port:
shanghai
Payment Terms:
T/T L/C D/P D/A Credit Card PayPal Other Cash Escrow
Delivery Detail:
5 days

Quick Details View All >

Brand Name:
MORE SUPER HARD
Place of Origin:
China
Model Number:
1A1
Size:
300
Type:
Abrasive Disc

MORE SUPER HARD COMPANY

Business Type: Manufacturer
Zhengzhou Henan China
Main Products: abrasive tools ,grinding wheel ,cutting tools ,diamond tools

Product Details

Vitrified bond suitable for silicon wafer back grinding wheel

Product Description

Diamond back  grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on Japanese, Korean grinders with high performance.

Main Features

Silicon back grinding wheel has the following features:

1. High efficiency 

2. Sharp grinding

3. Long life span

4. Good surface quality

5. High cost performance

Application

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer, gallium arsenide and GaN wafer.

Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.

Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.

.

 

The Specification Of Diamond Back Grinding Wheels:

Model

Diameter (Mm)

Thickness (Mm)

Hole (Mm)

 

6A2

175

30, 35

76

200

35

76

350

45

127

 

6A2T

195

22.5, 25

170

280

30

228.6

 

6A2T(Three Ellipses)

350

35

235

209

22.5

158

Other Size Can Ba Made According To Customers Requirements Email: @Moresuperhard.Com

 

silicon wafer back grinding wheel features:

1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2, processing accuracy: TTV<5 μm etc. (Total thinning veracity);

3, processing quality: surface roughness:<10 nm; damage layer thickness: <10 μm;

 

 

Application of back grinding wheel

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 

The LED substrate thinning grinding wheel is mainly used for the back surface thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and gallium nitride wafer in the LED industry. The grinding LED substrate grinding wheel developed by our company has superior grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines, and can replace imported products. 


If you need any products, do not hesitate to contact

Annamoresupe@gmail.com

Anna.wang@moresuperhard.com

WhatsApp:+8615617785923

Skype:Annawng

Wechat:15617785923

QQ:1664333593

Mobile:+86-156177854923

Tel/Fax:+86-0371-86545906


Contact Supplier

Ms. Anna sales Chat Now
Telephone
86-371-86545906
Mobile
86-15617785923
Fax
86-371-86545906
Skype
Annawng
Address
B906,wanda plaza,zhongyuan road Zhengzhou,Henan

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