Silicon grinding wheels/Silicon Wafer Back Grinding Wheels

PRODUCT DETAILS

Description:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.

Application:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Advantages:
1.High efficiency
2.High precision
3.Easy processing

DRAWING&SPECIFICATION

Model	D (mm)	T (mm)	H (mm)
6A2/6A2H	175	30, 35	76
	200	35	76
	350	45	127
6A2T	195	22.5, 25	170
	280	30	228.6
6A2T(three ellipses)	350	35	235
	209	22.5	158
Other specifications can be produced according to customers’ requirement.

If you need any products, do not hesitate to contact  

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@moresuperhard.com