Diamond Dicing Blades For Semiconductor Industry
PRODUCT DETAILS
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Description:
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.
Application:
For cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
For cutting Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
For cutting Electronic parts, Optical devices, semiconductor packages, BGA, CSP
For cutting Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
DRAWING&SPECIFICATION
Types | Features | Product Name | |
Electroformed dicing blade | Features: Easy to handle; Variety of different grit concentrations; Stable processing performance |
Hub dicing blade | |
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) | |||
Resin bond dicing blade | Features: High processing quality for cutting of hard, brittle materials; Improved cut quality on hard materials |
Hubless dicing blade | |
Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter | |||
Metal bond dicing balde | Features: High rigidity minimized wavy&slant cutting; Excellent rigidity and cut quality | ||
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, | |||
Electroformed dicing balde | Features: Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers | ||
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon | |||
Other specification can be produced according to customer’s requirements | |||