Application:

?9?9  Desktop

Features:

?9?9       SolderBall, SMT Soldering

?9?9       Land Grid Array at Contract Side

Specification:

Mechanical:

?9?9       Pitch:0.914mm (X)×0.914mm (Y)

?9?9       Durability: 20 Cycles

  Electrical:

?9?9       CurrentRating: Max. 0.3A / Pin

?9?9       Contact Resistance: Max. 25mΩ(Initial & Final)

   Physical:

?9?9       Housing:LCP, Black, UL 94V-0

?9?9       Contact: Copper alloy

?9?9ILM Frame:Low carbon steel

?9?9ILM Load Plate: Stainless steel

?9?9ILM Load Lever:Stainless steel

?9?9Screw / Shoulder Screw: Low carbon steel

?9?9BackPlate: Low carbon steel                              

?9?9         Solder Ball:SnAgCu

?9?9PnP Cap: LCP, Black

?9?9Plating: Min. 15u” gold plating on contact area

?9?9OperatingTemperature:-25℃~105℃

    Packaging:

?9?9       HardTray