Littelfuse 467 Series Cross 0603 Size Thin Film Very Fast-Acting Surface Mount Fuses With Rating 250mA-8A 63VDC 32VDC
Features
| • Compatible with leadfree solders and higher temperature profiles |
| • High performance materials provide improved performance in elevated ambient temperature applications |
| • Marked on top surface with code to allow amp rating identification without testing |
| • Low profile for height sensitive applications |
| • Flat top surface for pickand-place operations |
| • Element covering material is resistant to industry standard cleaning operations |
| • Mounting pad and electrical performance is identical to Littelfuse 431 and 434 Series products |
| • Halogen free, Lead-free and RoHS compliant |
| • High inrush current withstanding capability |
General
The 06.100 Series Fast-Acting Surface Mount Fuse (SMF) is an ultra small (0603 size) thin-film device designed for secondary protection of circuits used in space constrained applications such as hand-held portable electronic devices.
This series is 100% lead-free and meets the requirements of the RoHS directive. New Halogen-Free 467 Series fuses are available–to order use the “HF” suffix. See Part Numbering section for additional formation.
Applications
Secondary protection for space constrained applications:
• Cell phones
• Battery packs
• Digital cameras
• DVD players
• Hard disk drives.
Dimensions(Unit: mm/inch)
Pad layout (Unit: mm/inch)
Electrical Specifications by Item
| Part No. | Rated Voltage DC | Rated Current (A) | Breaking Capacity (A) 1 | Typical Cold. Resistance (mOhms) 2 | Typical Voltage Drop (mV) | Typical Pre-Arcing I2t (A2Sec) 3 | Alpha Mark | |
| 06 100 0.25 | 63V | 32V | 0.250 | 50A | 3250 | 893 | 0.00042 | D |
| 06 100 0.375 | 0.375 | 50A | 1310 | 587 | 0.00093 | E | ||
| 06 100 0.5 | 0.500 | 50A | 1070 | 582 | 0.0020 | F | ||
| 06 100 0.75 | 0.750 | 50A | 470 | 427 | 0.0092 | G | ||
| 06 100 1 | 1 | 50A | 257.5 | 295 | 0.018 | B/H | ||
| 06 100 1.5 | 1.5 | 50A | 137.5 | 220 | 0.065 | H | ||
| 06 100 2 | - | 2 | 50A | 72 | 160 | 0.115 | K | |
| 06 100 2.5 | 2.5 | 50A | 52 | 145 | 0.14 | L | ||
| 06 100 3 | 3 | 50A | 35 | 130 | 0.21 | O | ||
| 06 100 3.5 | 3.5 | 50A | 23.8 | 130 | 0.55 | R | ||
| 06 100 4 | 4 | 50A | 21 | 120 | 0.52 | S | ||
| 06 100 5 | 5 | 50A | 14 | 110 | 1.70 | T | ||
| 06 100 6 | 6 | 50A | 8 | 110 | 2.30 | V | ||
| 06 100 7 | 7 | 50A | 5.6 | 80 | 2.8 | X | ||
| 06 100 8 | 8 | 50A | 3.5 | 75 | 4.96 | Z | ||
| Clear Time Electrical Characteristics | ||
| Rated Current | 1.0In | 2.0In |
| 250mA~8A | 4 hour minimum | 60 sec maximum |
Clear Time Curve
Product Characteristics
| Materials | Body: Advanced High Temperature Substrate Terminations: 100% Tin over Nickel over Copper Element Cover Coat: Conformal Coating |
| Operating Temperature | -55C to 90C. Consult temperature re-rating curve chart. For operation above 90°C contact Ao littel |
| Humidity | MIL-STD-202, Method 103, Condition D |
| Thermal Shock | Withstands 5 cycles of – 55C to 125C |
| Vibration | Per MIL-STD-202 |
| Insulation Resistance (After Opening) | Greater than 10,000 ohms |
| Resistance to Soldering Heat | MIL-STD-202, Method 210, Condition D |
Packaging
| Packaging Option | Packaging Specification | Quantity |
| 8mm Tape and Reel | EIA-481 Rev. D (IEC 60286, part 3) | 5000 |
Soldering Parameters
| Reflow Condition | Pb – Free assembly |
| Pre Heat Temperature Min (Ts(min)) | 150°C |
| Pre Heat Temperature Max (Ts(max)) | 200°C |
| Pre Heat- Time (Min to Max) (ts) | 60 – 180 secs |
| Average ramp up rate (Liquidus Temp (TL) to peak | 5°C/second max |
| TS(max) to TL - Ramp-up Rate | 5°C/second max |
| Reflow - Temperature (TL) (Liquidus) | 217°C |
| Reflow - Temperature (tL) | 60 – 150 seconds |
| Peak Temperature (TP) | 250+0/-5 °C |
| Time within 5°C of actual peak Temperature (tp) | 20 – 40 seconds |
| Ramp-down Rate | 5°C/second max |
| Time 25°C to peak Temperature (TP) | 8 minutes Max. |
| Do not exceed | 260°C |
| Wave Soldering | 260°C, 10 seconds max. |