Product Details

Resin Bond Diamond Grinding Wheel

(1) High grinding efficiency, slow worn consumption.

(2) Good self-sharpness, low heat productivity when grinding, not easy to block, phenomenon of burning workpiece reduced.

(3) A certain flexibility improve the surface roughness of workpiece.

(4) Ready for use, various complicated non-standard products available as per customers’ requirements.

1A1

Specifications Of Resin bond diamond grinding wheel

Model	D (Mm)	T (Mm)	H (Mm)	X (Mm)	U (Mm)
1A1	80	10	32	8, 10
	150	10	32	10
	155	10	32	10
	160	10	32	10,12
	170	10	32	10, 12, 14
	175	10	32	10
	220	10	32	20
14A1	170	10	32	10, 12, 14	5
14A1	175	10	32	10, 15	5
Grain Size :MD20, MD40, MD60, MD80 MD-20: Fine Polishing,Perfect Shining Performance And Long Life For Polishing Small Diamond (10 Points- 1carat) MD-40, MD-60: Rough Polishing,High Efficiency Polishing And Sharp Cutting For Big Diamond.(1ct ,1.2ct And 1.3 Carat,Etc) MD-80: Rougher Polishing, Higher Efficiency And Sharp Cutting For Bigger Stones.(2 Carat And 3 Carat,Etc)