Resin Bond Diamond Dicing Blades for Silicon Wafer
USD $30 - $60 /Piece
Min.Order:10 Pieces
Hong Cheng Super Hard Material Co., Ltd
Resin bond dicing blade can self-sharpen and cut sharply.
The quality of the surface can be improved due to the elastic resin bond.
Resin diamond dicing blade
Features: High Processing Quality For Cutting Of Hard, Brittle Material,
Able To Precisely Control Diamond Concentration,
To Achieve Cutting Quality; Improved Cut Quality On Hard Materials
Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter
D T |
25-60 |
70-78 |
80-110 |
110-125 |
127-200 |
Thickness limit deviation |
0.07 |
±0.002 | |||||
0.1 | ||||||
0.2 | ||||||
0.3 |
±0.003 | |||||
0.4 | ||||||
0.5 | ||||||
1.0 | ||||||
1.5 | ||||||
2.0 | ||||||
H | 6, 8, 9, 10, 12.7, 25.4, 31.75, 40, 41.275, 50.8, 76.2, 69.875, 88.9, 114.3 |