Resin Bond Diamond Dicing Blades for Silicon Wafer

Resin Bond Diamond Dicing Blades for Silicon Wafer

USD $30 - $60 /Piece

Min.Order:10 Pieces

Supply Ability:
1000 Piece / Pieces per Month
Port:
Shanghai
Payment Terms:
T/T PayPal Cash Other
Delivery Detail:
15 days

Quick Details View All >

Brand Name:
More Super Hard
Place of Origin:
China
Model Number:
1A8
Size:
55*0.2*40
Type:
Abrasive Disc

Hong Cheng Super Hard Material Co., Ltd

Business license
Business Type: Distributor/Wholesaler
Zhengzhou Henan China
Main Products: vitrified bond tools , resin bond tools , metal bond tools , electroplated diamond/CBN tools , Vaccum brazed products

Product Details

Resin bond dicing blade can self-sharpen and cut sharply.

The quality of the surface can be improved due to the elastic resin bond.

 

Resin diamond dicing blade

Features: High Processing Quality For Cutting Of Hard, Brittle Material, 

Able To Precisely Control Diamond Concentration, 

To  Achieve Cutting Quality; Improved Cut Quality On Hard Materials

 

Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, Splitter 

  D

T

 

25-60

 

70-78

 

80-110

 

110-125

 

127-200

 

Thickness limit deviation

0.07






 

±0.002

0.1






0.2






0.3






 

 

 

±0.003

0.4






0.5






1.0






1.5






2.0






H

6, 8, 9, 10, 12.7, 25.4, 31.75, 40, 41.275, 50.8, 76.2, 69.875, 88.9, 114.3


Contact Supplier

Ms. Robert Sales Chat Now
Mobile
86-13526675653
Skype
robert20160632
Address
Er Qi Distinct Zhengzhou,Henan
Whatsapp
86 13526675653

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