Ceramic PCB Board Capabilities:
Layer：1，2
Material：96% Alumina，99% Aluminium nitride(AIN),Sapphire,High Borosilicate Glass
Material Thickness(mm)：0.38，0.5，0.635，1.0
Material Size(mm)：120*120，127*127，132*132，140*130，150*200
Min Hole：0.075mm
Min Line width/space：0.1/0.1mm
Laser Outline: line width：0.1mm，tolerance：+/-0.1mm
Surface Finish:Immersion Silver,Immersion Gold,Immersion Tin,OSP
Copper Thickness(oz):H/H  1/1  2/2  3/3  4/4  5/5  6/6  7/7  8/8  9/9  10/10
Thermal conductivity value:  20~27W/m.K for Alumina; 180W~220W/m.K for Aluminium nitride , 27~30W/m.K for Sapphire,2 ~ 5 W/m.K for High Borosilicate Glass

Do not need to change the original processing procedures
Excellent mechanical strength
With good thermal conductivity
With resistance to erosion
Good surface characteristics, excellent flatness and flatness
Good thermal shock resistance
Low curl degree
Good stability under high temperature can be processed into a variety of complex shapes

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