The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc.

◆◆The H.F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of IC, commutator, transistors and other micro-electronic components.