Resin bond daimond dicing Blade for semicoductor,ceramic chips
Resin bond high precision dicing blades without steel core are made of the same materials, with thin thickness and and high precision, they are mainly used for slotting and cutting the semiconductor, optical glass, quartz glass, ceramics and so on.More super hard series are sintered diamond blades employ thermo-setting resin as the bond material. Taking advantage of its excellent elasticity, the ability of this bond to cut has been maximized. They are suitable for processing of hard-to-cut materials such as glass and crystal materials.
Metal bond blade
Good wear resistance, good shape maintenance and long worklife.
Resin bond blade
Goodself-sharpen, perfect fracture surface quality.
Saw blade without steel plate
With thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and slight cutting depth.
Features:
Self-sharpness, high cutting ability and efficiency.
Excellent bond elasticity, improve cutting quality.
Application: Glass, Quartz,especially for semoconductor.
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