Hubless Resin Diamond Dicing Blade for Semiconductor

FOB Price USD $80 - 120 / Piece
Min.Order Quantity 1 Piece / Pieces
Supply Ability 1000 Piece / Pieces per Month
Port Shanghai
Payment Terms T/T PayPal Other Cash
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Company Profile

Business Type Distributor/Wholesaler
Year Established 2022
We Provide vitrified bond tools , resin bond tools , metal bond tools , electroplated diamond/CBN tools , Vaccum brazed products
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