Product Details

Pulse Heat Bonding Machine for FPC to PCB ,CWPP-1S

Pulse Heat Bonding Machine for FPC to PCB ,CWPP-1S Features:

1.Unique pulse heat technology provides fastest soldering head heating.
2.Programmable soldering temperature, heat-up rate and time duration for a wide range of products.
3.Thermocouple is fixed in close proximity to the working surface & the
thermode, thus providing accurate temperature feedback control.
4.Closed Loop PID temperature control with clearly visible LED display.
5.Soldering time can be programmable and is triggered by temperature.
6.Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.
7.Programmable pressure switch with LCD display for precise force control.

8.CCD camera system with magnification lens can be retrofitted for finepitch positioning.

Pulse Heat Bonding Machine for FPC to PCB ,CWPP-1S Specification: