1. layer:1-22

2. Board finished thickness:0.2mm-7.0mm

3 . Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers

4. Max. Finished board size:580*900m

5. Min hole size:4mil(0.1mm)

6. Min trace width/space:3.5mil

7. Surface finishing/treatment:HASL/Lead free HASL,Imemersion sliver,immersion Tin,OSP

8. Copper thickness:0.5oz to 6oz

9. solder mask color:green/yellow/black/red/blue

10. Copper thickness in hole:>18um

11.Outline tolerance :0.13mm

Hole size tolerance:PTH0.076mm NPTH0.05mm

12.Quality ensure:UL approval TS16949:2002

13.Buried and Blind vias,impedance control ,via plug,BGA soldering,Gold finger