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4 Layer PCB
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Product Details
HDI R-F Multi-Layer PCB with HASL Finishing
· Vendor to be UL recognized
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR-4 or other
· Date code location: Printed on Top/Bottom/Side Silkscreen Layer
· Etch on Top/Bottom/Side Copper Layer.
· All PCB will be electrical tested before shipment
· Legend Silkscreen: Top or Bottom side
· Solder mask color: Green/Blue/Yellow/Red/Other
· Complied ROHS standard
· Packing: Inner vacuum packing; Outer carton packing:
· FOB Port: Shenzhen or HK
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HDI |
||
|
Item |
Mass Production |
Prototype |
|
HDI structure |
1+N+1,1+1+N+1+1 |
2+N+2 |
|
Buried hole |
Filled |
Filled |
|
Aspect ratio |
0.75:1 |
0.75:1 |
|
Minimum laser hole |
0.1mm(4mil) |
0.1mm(4mil) |
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Minimum laser pad |
0.25mm(10mil) |
0.25mm(10mil) |
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Blind hole |
No filled |
No filled |
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Rigid & Flex board |
NO |
YES |
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Press fit hole |
YES |
YES |
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Control Depth drilling |
YES |
YES |
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Lead-free &Halogen-free |
YES |
YES |
|
Immersion Gold |
Ni:2-5µm Au:0.05-0.10µm |
Ni:3-6µm Au:0.075-0.15µm |
|
Immersion Tin |
0.6-1.2µm |
0.6-1.2µm |
|
Immersion silver |
0.2-0.6µm |
0.3-0.6µm |
|
OSP |
0.1-0.4µm |
0.25-0.4µm |
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HASL (Sn-Pb&LF) |
Pad:>3µm /Big Cu:>1µm |
Pad:>4µm Big Cu:>1.5µm |
|
Flash Gold |
Ni:3-6µm Au:0.01-0.05µm |
Ni:3-6µm Au:0.02-0.075µm |
If there is any question about HDI R-F Multi-Layer PCB with HASL Finishing, please don’t hesitate to contact Mr. Cai at below information:
SKYE: C527982359
Tel:
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