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Liquefied Colorless Electronic Gases , Halocarbon 116 Fluorocarbon Gas

Description:

Electronic Gases Hexafluoroethane is used as a versatile etchant in semiconductor manufacturing. It can be used for selective etching of metal silicides and oxides versus their metal substrates and also for etching of silicon dioxide over silicon. The primary aluminum and the semiconductor manufacturing industries are the major emitters of hexafluoroethane.

Hexafluoroethane is relatively inert. The mixture is nonflammable and nontoxic, though asphyxiation may occur because of displacement of oxygen. Under prolonged exposure to fire or intense heat the containers may rupture violently and rocket.

Hexafluoroethane is chemically inert in many situations, but can react violently with strong reducing agents such as the very active metals and the active metals. Can react with strong oxidizing agents or weaker oxidizing agents under extremes of temperature.

Vapors may cause dizziness or asphyxiation without warning. Vapors from liquefied gas are initially heavier than air and spread along ground. Contact with gas or liquefied gas may cause burns, severe injury and/or frostbite. Fire may produce irritating, corrosive and/or toxic gases.

Some may burn but none ignite readily. Containers may explode when heated. Ruptured cylinders may rocket.

Specifications:

1. Physical properties

Commodity	Hexafluoroethane
Molecular Formula	R116
CAS No	76-16-4
UN No.	2193
Hazardous Class	2.2
MF:	C2F6
Cylinder Capacity	40L, 500L
Filling Weight	530kg/500L refillable cylinder  20kg/40L refillable cylinder
Storage and Transportation	Use, store and transport below 45C. Store in cool and well-ventilated areas. Keep away from fire, heat, sunlight and flammable substances. Handle carefully when loading and unloading to avoid damages to gas cylinders and accessories.

2. Typical technical data

Purity, %	≥99.8
Moisture, PPm	≤10
Acidity, PPm	≤1
Vapor Residue, PPm	≤100
Appearance	Colorless, No turbid
Odor	No Strange Stench

Molecular Weight	66.1
Boiling Point, °C	-24.7
Critical Temperature, °C	113.5
Critical Pressure, Mpa	4.58
Specific Heat of Liquid, 30°C, [KJ/(kg°C)]	1.68
ODP	0
GWP	0.014

Applications:

Multi - Functional Etching Technology	In The Production Of Semiconductor etching of metal
The Metal Substrate	It can be used in the selective etching of metal silicon metal and metal oxide. Under prolonged exposure to fire or intense heat the containers may rupture violently and rocket.