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Description:Supply PCB, IC. PCB specifications: 1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML 2) Max. spelling board size: 457 x 762mm, large board size possible upon requests 3) Layers single double 4-16 layers 4) Board thickness: 0.2-2.5mm 5) The smallest aperture: 0.2mm 6) The smallest width of line: 0.10mm 7) The smallest distance of line: 0.10mm 8) The smallest SMT jointing plate: 0.3mm 9) Warp permitting value of board surface: +-0.7% 10) The smallest bridge of hinder jointing: 0.10mm 11) Surface craft: HAL flash gold OSP cold contacts immersion gold 12) Special craft: blue or yellow character open hole or taphole 13) Hinder jointing: liquid sensitization glue 14) Skewer head gilt: nickel 5um; gold 0.75um 15) Figuration making: Numerical control mill/opened V trough/rush and cut 16) Solder mask: PSR4000, PSR2200 17) Profile: routing, punching, scoring 18) Inspection: 100% E-test 100% visual inspection, AOI for inner-trace