Any-layer HDI Printed Circuit Boards are the next technological enhancement of HDI microvia PCBs,Website: , all the electrical connections between the individual layers consist of laser-drilled microvias, the main advantage of this technology is that all the layers can be freely interconnected. Key SpecificationLayer Count4~16MaterialFR-4(Tg150), FR-4(Tg170), FR-4(Tg180)Finished Thickness0.8~3.2mmFinished Outer Cu Thickness1OZFinished Inner Cu ThicknessHOZ, 1OZSurface FinishLead-free HASL, Immersion Gold/Tin/Silver/Ag, OSPSoldermaskGreen, White, Black, Blue, Red, YellowSilkscreenWhite, BlackStepAny-layerAttention: "These are the basic specifications we gonna to need for your Printed Circuit Board fabrication, if you need a quick quote or going to order soon, to save time please kindly provide all the fabrication details to us, of course if there were any other special requirements or details out of this specification, please also comment so we can consider it in our quotation."           --From Union Circuits Engineering dept.Product DetailsMOQ1 PieceProduction Lead Time8~15 Working Days Quick turn, 10~20 Working Days mass productionLaser Drilling Hole Size4mil, 5mil, 6milMin. Trace Width/Spacing3/3milData FormatGerber RS-274-D/X, .pcb, .pcbdoc, .cam, ODB++, CADE-Test100% E-test(cost included in the Unit Price, NO extra charge)CertificationsUL, CUL, ISO9000, ISO14001, TS16949.StandardIPC-A-600H Class 2(default), Class 3 (base on request)ApplicationCellphone, computer, communication equipment, instrumentation…PackingInner vacuum + foam, Outer carton boxShippingDHL(default), UPS, TNT, FedEx, EXW, FCA/FOB HongKong, By SeaPaymentT/T, PayPal, Western Union (USD, EUR)