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High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting

High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting

Negotiable /Piece

Min.Order:1 Piece

Supply Ability:
0 Piece / Pieces per Month
Payment Terms:
T/T L/C D/P D/A
Delivery Detail:
7 days

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Place of Origin:
China

Luoyang Bearing Science And Technology Co.,Ltd.

Business Type: Trading Company
China
Main Products: Bearing ,ball bearing ,angular contact ball bearing ,slew ring ,deep groove ball bearing , roller bearing ,manufacturing machine ,grinding spindle , Test machine ,bearing measurement
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Product Details

High-frequency spindles for cutting performanceZYS high-frequency spindles for wafer dicing use air static pressure bearings,Website: , and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.ParametersTypeSpeedr/minKWVoltageVCurrentAFrequeceHz92GD40Q400000.752202.666680GD30Q300000.51652.5500

Contact Supplier

Ms Wang Baolei e-commerce manager Chat Now
Telephone
86-0379-64886096
Mobile
0086-13937923793
Fax
86-0379-64881529
Address
No.1 Jilin Road, Luoyang City,Henan Province,China Zhoushan,Zhejiang
Showroom
https://ezuwirireh.goldsupplier.com/

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Place of Origin:
China