1) Layer: 1-28
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size:3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
8) Copper thickness: 0.5-7.0 OZ
10) Solder mask color: green/yellow/black/white/red/blue
11) Copper thickness in hole: >25.0 um (>1mil)
12)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
13) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14) Certificate: UL, ISO 9001, ISO 14001,SGS , RoHS
