Product Details

Silicone thermal pad
1.Thermal Conductivity:2.5w/m.k
2.High Thermal Performance and cost effective
3.Use Japan ceramic

Silicone thermal pad

Features&Benefits:

1.High thermal conductivity

2.High conformability and softness

3.Naturally tacky

4.Electrically insulating

Typical Application:

1.Between electronic components such as Semiconductor,IC, CPU.MOS and heatsink.

2.Telecom and communication devices, LCD TV, Telecom device,wireless

Hub,NB,PC,notebookds,etc

3.Cooling module, in all applications where a metal housing is used as heatsink

Configurations:

·Standard size for sheet form:200x400mm

·Thickness:0.5-5.0mm

·With or without fiberglass,in the surface or certerred

·Could be die-cut or pre-applied to heat sinks

Rohs&Reach compliance:yes,for the certificates,please contact our sales!

*Typical Properties of Gap Pad LD8250*
Property	Unit	Metric Value	Test Method
Color	***	Yellow	Visual
Thickness	mm	0.5-5.0	ASTM D374
Density	g/cc	3.0	ASTM D792
Hardness	Shore C	25±5	ASTM D2240
Tensile Strength	KN/m	0.42	ASTM D412
Continuous Use Temp.	°C	-40-150°C	EN 344
Electrical
Breakdown Voltage	Kv/mm	≥5.3	ASTM D149
Volume Resistivity	Ω.cm	3.2×10¹⁶	ASTM D257
Flame rating	V-0	V-0	UL 94
Thermal
Thermal Conductivity	W/m.k	2.5	ASTM D5470