Manufacturers to customer! IR infrated hot air bga rework station ZM-R5830 with touch screen for iphone sumsung /laptop motherboard repair

Main fetures

1.3 independent heaters

2.IR infrated +hot air heating

3.Touch screen control

Positioning                   V-groove +laser positioning+ universal fixture

PCB size                     Max 410×370 mm

Preheating size                370mm×270mm

Chip type                     BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads

Chip size                     Max 80×80mm        Min 2×2 mm

Dimensions                   L640×W630×H920 mm