Delivery Time:10-30days
Certification:UL/ISO/ROHS/SGS

PCB Design And Fabrication 10 Layer  Bga Tg170 Gold Finger Hole Size 0.2mm

	Product Description
Model Number:	CTEL1010200
Number of Layer:	10Layer
Material:	FR4 tg170
Finish  Thickness:	2.4mm
copper:	1oz
PCB Size :	55*109mm
Line Width/line space	10/8mil
Min.Hole size :	0.2mm
Surface finish :	Gold finger
	Green solder mask
	White sillkscreen
Place of Origin:	China
Brand Name:	ChiTun
Certification:	UL,ROHS,ISO
Standard:	IPC  standard

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008\" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP