High TechnologyLead Free SMT PCB Assembly Through Hole Circuit Board

High TechnologyLead Free SMT PCB Assembly Through Hole Circuit Board

Negotiable /Piece

Min.Order:1 Piece

Supply Ability:
0 Piece / Pieces per Month
Payment Terms:
T/T L/C D/P D/A
Delivery Detail:
7 days

Quick Details View All >

Brand Name:
HUASWIN
Place of Origin:
China
Model Number:
HSPCBA1081

Huaswin Electronics Company Group

Business Type: Trading Company
Main Products:

Product Details

Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

High Technology Lead Free SMT PCB Assembly Through Hole Circuit Board

Specifications

- Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds

PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers) 

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 

Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, 

Aluminum-based material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, 

OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials 

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days 

8

Testing

Contact Supplier

Ms. Vicky Lee sale Manager Chat Now
Telephone
86-755-29077956
Mobile
86-13632657851
Fax
86-755-29077961
Skype
vicky_hamco
Address
28D, Block D, Jin Gang Hua Ting Liaocheng,Shandong

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