Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

Rigid 8 Layer Surface Mount SMT PCB Assembly , Automatic Optical Inspection

Specifications

1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products 
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers\' requests or samples. Plastic injection processing available. 
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly. 
4. ROHS compliant and lead-free process. 
5. In-circuit, functional tests& burn-in tests, full system test 
6. High output to guarantee prompt delivery.

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based  material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,  OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

PCB Assembly services: 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 

Material Sourcing 
IC pre-programming / Burning on-line 

Function testing as requested 

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201\" 
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing