High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness＞2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/
Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:0.1mm
1.0mm<Board thickness≤2.0mm:10%
Board thickness>2.0mm:8%

Board thickness≤1.0mm:0.1mm
1.0mm<Board thickness≤2.0mm:10%
Board thickness>2.0mm:8%

Outline Tolerance

≤100mm:0.1mm
100< ≤300mm:0.15mm
>300mm:0.2mm

≤100mm:0.13mm
100< ≤300mm:0.15mm
>300mm:0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

　0.08mm

　0.10mm

Plugging Vias capability

　0.25mm--0.60mm

　0.70mm--1.00mm