Delivery Time:3-20 days
Certification:UL E354810, SGS, ISO9001:2008

Number. of Layers:	4
Laminate Material:	FR4
Surface Finish:	ENIG, Gold Thickness: 4U
Copper Thickness:	1 OZ
Board Thickness:	1.6mm (0.062”)
Board Size:
Color of Mask:	White
Color of Silkscreen:	Black with Non-Conductive Ink
Flammability:	UL 94V-0
Workmanship:	Compliance with IPC-A-600 & IPC-6012 CLASS II
Thermal Conductivity	-

Capacity

	High precision prototype	PCB bulk production
Max Layers	1-28 layers	1-14 layers
MIN Line width(mil)	3mil	4mil
MIN Line space(mil)	3mil	4mil
Min via (mechanical drilling)	Board thickness≤1.2mm	0.15mm	0.2mm
Board thickness≤2.5mm	0.2mm	0.3mm
Board thickness＞2.5mm	Aspect Ration≤13:1	Aspect Ration≤13:1
Aspect Ration	Aspect Ration≤13:1	Aspect Ration≤13:1
Board thickness	MAX	8mm	7mm
MIN	2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm	2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size	610*1200mm	610*1200mm
Max copper thickness	0.5-6oz	0.5-6oz
Immersion Gold/ Gold Plated Thickness	Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u”
Hole copper thick	25um 1mil	25um 1mil
Tolerance	Board thickness	Board thickness≤1.0mm:0.1mm 1.0mm<Board thickness≤2.0mm:10% Board thickness>2.0mm:8%	Board thickness≤1.0mm:0.1mm 1.0mm<Board thickness≤2.0mm:10% Board thickness>2.0mm:8%
Outline Tolerance	≤100mm:0.1mm 100< ≤300mm:0.15mm >300mm:0.2mm	≤100mm:0.13mm 100< ≤300mm:0.15mm >300mm:0.2mm
Impedance	±10%	±10%
MIN Solder mask bridge	0.08mm	0.10mm
Plugging Vias capability	0.25mm--0.60mm	0.70mm--1.00mm

Advantage

1. Factory directly

2. Comprehensive quality control system

3. Competitive price

4. Quick turn: as fast as 48hours.

5. Certification (ISO/ UL E354810/ RoHS)

6. 8 years experience in exporting service

7. No MOQ/MOV.

8. Reliable quality: AOI (Automated Optical Inspection), QA/ QC, flying probe, E-testing, etc