AirPrimeSL Series offers smart connectivity for consumer and industrial applications.Its standard 25 x 30 mm LGA (Land Grid Array) package allows fully automatedmanufacturing for high-volume production.
Available in multiple air interfaces versions(EDGE, HSDPA, HSPA+, CDMA 1xRTT and EV-DO), the AirPrime SL Series presents aneasy upgrade path to next-generation network technologies.
With its application framework and cloud-baseddevice management services, the smart AirPrime SL Series accelerates your M2Mdeployment. AirPrime SL Series modules have a solid track record in several M2Msectors such as transportation, energy, industrial, security, sales &payment, networking, fi eld service and healthcare.
Key Features
Industry standard 25 x 30 mm LGA (Land Grid Array) package
Available in version for: EDGE, HSDPA, HSPA+, CDMA 1x and EV-DO
Extended temperature to support industrial applications
Key Benefits
Footprint compatible. Easy upgrade path between global 2G and 3G markets. Scale easily from one device to millions.
Lower deployment time and costs: LGA form factor allows high-volume automated production
Simplify M2M deployment and operations with application framework, development tools and pre-integrated secure cloud services
