Delivery Time:5-8 days
Certification:UL,RoHs,SGS,ISO9001-2008

Aluminum Based LED Light PCB /  SMD or Cree Metal Clad PCB MCPCB Double Layer

Professional PCB Manufacturing

Base Material: Aluminum/FR4/CEM1/CEM3 Layer: 1 layer/2 layers Board Thickness: 0.3-3mm Min.Board Dimension: 4x4mm Max.Board Dimension: 1500x600mm Copper layer: 1oz/2oz/3oz Solder Mask: White/Black/Blue/Red Silkscreen: Black/White Surface finish: LF HAL/HAL/OSP/Gold immersion/Silver plating Outline Profile: CNC routing/V-Cut/Punching All of the parameters can be customized!

Professional PCB Assembly:
Professional Surface-mounting and Through-hole soldering Technology.
Various sizes like 1206,0805,0603 components SMT technology.
ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
PCB Assembly With UL,CE,FCC,Rohs Approval.
Nitrogen gas reflow soldering technology for SMT.
High Standard SMT&Solder Assembly Line.
High density interconnected board placement technology capacity.
Assemble pcb for you,plz click here
 
Our Quality Requirement:
We are now implementing international quality system includes: UL(E465880) ,TS16949 ,ISO14001, ISO9001

Quality target:
on-time delivery:≥98% ;
double layer board acceptability:≥97%
four-layer board acceptability:≥95%
six-layer board acceptability:≥92%
eight-layer board acceptability:≥88%
ten-layer board acceptability:≥85%
customer satisfaction :≥98%
complaint rate/rejected rate:≤ 1%

Our Environment Policy:
We committed to:
Comply with environmental regulations
Prevent any environmental accidents
Prevent pollution and reduce wastage
Minimize the consumption of resources
Education our employee in the awareness of the environmental protection
Set up environmental Management system and strengthen environment policy
RoHS compliance and Lead Free

Applications

It can be use 2835,5630,3014,5050,3525,CREE,Nichia,Osram LEDs

For all kinds of LED light

Lead Time

Samples: 3-4 days

Mass Production: 7-15 days(depend on the quantity)

Payment Terms

T/T,Western Union

Packing and Shipment

Vacuum package in carton

Factory Capability

Item	Manufacturing Capability
Surface Treatment	OSP Immersion Gold Immersion Silver Immersion Tin Lead Free HAL Plating Silver
PCB Layer Type	Single side,Double side
Max. Working Panel Size	1500mm*600mm
Min. Working Panel Size	4mm*4mm
AL Substrate Thickness	0.3mm-4mm
Min. Conductor width	0.15mm
Min. Conductor spacing	0.15mm
Min. Drilling hole size	0.2mm
Plate Thickness Tolerance	±0.1mm
Finished Panel Tolerance	±0.1mm
V-CUT Alignment	±0.1mm
Hole Dia Tolerance	±0.05mm
Hole Position Tolerance	±0.076mm
Finished Copper Thickness	35um-105um(1oz-6oz)
Etching Under Cut	>/=2.0
PTH&Panel Plating Uniformity	>90%
Eing/Flash Gold Thickness	1-5u’’
Solder Mask Thickness	15um-35um
Min. Solder Mask Bridge	0.076mm(3mil)
Silk Screen	White/Black(depend on your requirements)
Thermal Conductivity	1.0~20W/MK
Withstand Voltage	AC 2000V,DC 1500~4000V