Material

FR4 High TG

Layer count

12 layers

Board thickness

1.6mm

Copper thickness

Inner layer 0.5oz, out layer 1oz 

Minimum drill size

0.1mm

Minimum trace & gap 

0.075mm

Surface finish 

Immersion silver

Applications

Communication  

Special Technology

HDI board with laser drill 

Blind vias: 1-2, 11-12, buried vias: 2-11

NO

ITEM

Technical capabilities

1

Layers

1-20 layers

2

Max. Board size

508×610 mm

3

Min. board Thickness

2-layer 0.12mm

4-layer 0.4mm

6-layer 0.6mm

8-layer 0.90mm

10-layer 1mm

4

Min. line Width/Space

0.127mm(4mil)

5

Max. Copper thickness

5OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.15mm(6mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)