Material

Copper base 

Layer count

1 layers

Board thickness

1.6mm

Copper thickness

1oz

Minimum drill size

0.6mm

Minimum trace & gap 

0.4mm

Surface finish 

OSP

Applications

Telecommunication products

Special Technology

Copper based material 

NO

ITEM

Technical capabilities

1

Layers

1-20 layers

2

Max. Board size

508×610 mm

3

Min. board Thickness

2-layer  0.12mm

4-layer  0.4mm

6-layer  0.6mm

8-layer  0.90mm

10-layer  1mm

4

Min. line Width/Space

0.127mm(4mil)

5

Max. Copper thickness

5OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.15mm(6mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)