Layers count: four

Board thickness: 1.6mm

Copper thickness: 1oz

Size: 133 x 172/3up

Base materials: FR4, aluminum, FPC and copper

Copper thickness: 0.5oz (minimum)

Copper thickness: 4oz (maximum)

Board thickness: 0.2mm (minimum)

Board thickness: 3.2mm (maximum)

Surface finish: HAL, ENIG, OSP, gold finger, tin chemistry

Possible solder-mask colors: green, black, white, yellow, blue, red and more

Board dimension: 600 x 1,000mm

Hole diameter: 0.2mm (minimum)

Line width: 0.075mm (minimum)

Line spacing: 0.075mm (minimum)

SMT pitch: 30 degrees (minimum)

Annular ring: 0.05mm (minimum)

Aspect ratio: 11:01

Surface/hole plating tolerance

Hole tolerance (PTH): 0.25mm

Hole tolerance (NPTH): 0.15mm

SM tolerance (LPI)

Electrically test: yes

RoHS Directive-compliant

Possibility of SMT device mounting: yes