Applicable PCB: L50mm × W50mm to L700mm × W460mm

Minimum component: 0201

Minimum QFP pitch: 0.4mm

Minimum IC pitch: 0.30mm

Minimum BGA ball diameter: 0.40mm, ball pitch: 1.0mm

Maximum BGA size: 74x74mm

Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test, and packing

Mounting capability:9,000,000 chips a day. DIP: 700,000 pcs a day. We are planning to prepare 2 lines more this year

Applications of our product: SMPS, PCI, mother board, controller, CCTV, telecommunication, DVD, MP3, GPRS, military, and so on

No MOQ

All inquiries will be replied within 2 hours

competitive price and short lead time

Rich experience in importing& exporting

Good relationship with all kinds of forwarde

Applicable PCB: 50 x 50mm to 700 x 460mm

Minimum component: 0201

Minimum QFP pitch: 0.4mm

Minimum IC pitch: 0.30mm.

Minimum BGA ball diameter: 0.40mm, ball pitch: 1.0mm

Maximum BGA size: 74x74mm

Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test, and packing

Mounting capability: 9,000,000 chips a day. DIP: 700,000 pcs a day. We are planning to prepare 2 lines more this year

Applications of our product: SMPS, PCI, mother board, controller, CCTV, telecommunication, DVD, MP3, GPRS, military, and so on