Inner layer: 4oz

Outer layer: 5oz

Surface treatment: HASL (LF), immersion gold, flash gold, OSP, immersion tin, immersion silver, HASL, gold finger and selective nickel

Laminates: CEM-3, PTFE, FR-4 (high-TG), metal base (AL, CU) and rogers

Layers: 16 (maximum)

Board size: 20 x 48 inches (maximum)

Board thickness: 0.4 to 5.5mm

Maximum copper thickness:

Track width: 4 mils or 0.1mm (minimum)

Track space: 4 mils or 0.1mm (minimum)

Hole size: 8 mils or 0.2mm (minimum)

Laser hole size: 4 mils or 0.1mm (minimum)

PTH wall thickness: 0.8-mil or 20μm

PTH diameter tolerance: ±3 mils or±76μm

NPTH diameter tolerance: ±2 mils or±50μm

Aspect ratio: 10:1

Impedance control: ±10%

Size: 10 x 10mm

Base material: FR4

Layer count: four layers

Board thickness: 1.6mm

Copper thickness: 1oz

Surface finishing: HASL

Soldermask color: green

Size: 140 x 4 x 149.46/2up