FOG/FOB bonding machine XCM71-A6

1、The definition of FOG/FOB bonding machine XCM71-A6:
FOG/FOBbonding machine  referred to as "state machine" "hotpress," usingheat pipe and pulse to heat , mainly applicable to capacitive touch screen(CTP), LCD module production and maintenance processes FPC, COF, TAB bondingcombination with the LCD and PCB after attached  a  ACF. use head pressure,  head temperature, bonding time, optical alignmentsystem bonding with LCD FPC, ACF  glue which is  betweenthe PCB so that it can   conduct. 

2、 About the application field of  FOG/FOB bondingmachine XCM71 -  A6
FOG/ FOB bonding equipment is widely used in a variety of LCD and the large sizeof display panel's production and maintenance; such as: television (TV), laptopcomputers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD/ LCM production enterprises. 
3、About the working principle of FOG/FOB bonding machineXCM71 - A6
Workingprinciple of FOG / FOB bonding equipment XCM71-A5 is to usingheat pipe and pulse to heat , mainly applicable to capacitive touch screen(CTP), LCD module production and maintenance processes FPC, COF, TAB bondingcombination with the LCD and PCB after attached  a  ACF. use head pressure,  head temperature, bonding time, optical alignmentsystem bonding with LCD FPC, ACF  glue which is  betweenthe PCB so that it can   conduct. 
 
4、About the basic parameters of FOG/FOB bonding machine XCM71-A6
InputPower: AC220V 50-60Hz 
Workingpressure :0.4-0 .8 Mpa 
Operatingmodes: 7-inch HMI 
Dimensions:L2210 × W1730 × H1500 mm 
Themethod of Heating: heating or pulse heating thermostat 
Thequantity of Fixture: 2 group X-Y-θ micrometer adjustable 
Rangeof Temperature : RT-500 ℃ 
Controlprogram: PLC controller 
Bodymain material: Steel + baking varnish
Thethermocouple: K type