Delivery Time:7-15days
Certification:ISO
Multilayer Flex rigid PCB FR4 , CU(RA 18um+AD 15UM+PI 12.5um and SMD , DIP , AI assembly Specifications1. Multilayer Flex rigid PCB
2.SMD,DIP,AI,OEM/ODM assembly
3.Functional test
4.ISO9001,ISO14001 certificate
2.SMD,DIP,AI,OEM/ODM assembly
3.Functional test
4.ISO9001,ISO14001 certificate
Multilayer Flex rigid PCB
Technical Specification |
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Materials | Polyimide/Polyester | Remark&Test Method |
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Number of Layer | FPCB 1-8/Rigid-flex:3-6 | ||
Min.Trace Width/Space | Single Side | 0.050mm(2mil) | |
Double Side | 0.050mm(2mil) | ||
Min.Hole Diameter | Drilling(P.T.H.) | φ0.15mm | |
Punching | φ0.50mm |
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Dimension Tolerance | Conductor Width | 20% | W≤0.5mm |
Hole Diameter(H) | 0.05mm | H≤1.5mm |
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Accumulated Pitch | 0.05mm | P≤25mm |
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Outline Dimension | ±0.1mm | L≤50mm |
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Conductors And Outline | ±0.07mm | C≤5.0mm |
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Surface Treatment On Terminal And Land Area | Au(0.03-1.5um) | ||
Ni(1-6um) |
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Sn(7-20um) |
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Peeling Strength(180° Direction) | 1.0kg f/cm | IPC-TM-650 2,4,9 |
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Solder Heat Resistance | 260/10 secs |
Multilayer Flex rigid PCB
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