infrared hot air BGA Rework Station repairing laptop PCB / motherboard
Negotiable /Piece
Min.Order:1 Piece
Guangzhou Yihua Electronic Equipment Co., Ltd
540W ic BGA Rework Station ,infrared soldering station repairing circuit boards
Digital LED automatic Temperature Controlled Soldering Station , 220v
150W High frequency Temperature Controlled Soldering Station / solder stations
100W Electronic IC Lead free soldering rework station , YIHUA 900H
smd temperature control Electronic PCB soldering station 75W
pcb / Circuit board temperature controlled soldering station
YIHUA 1000B infrared BGA Rework Station ,Preheating station +hot air rework +soldering station +IR +Lamp
Feature
1. Using the new SAMSUNG microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
2. Adopt infrared weld technology which independent exploration, infrared penetration strength, components uniform heating, beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.
3. Technician focused infrared heat is easy to target most component removal/replacement and re-work.
4. Infrared heat source bulbs are long-lived, un-expensive and easily replaced.
5. Has bright delicate, low voltage LED lighting, safety and energy conservation.
6.It has External Sensor Temperature control mode, that is detected by the sensor IC surface temperature control temperature, this function is good for freshman operation ,it’s safe way protect components .
7.MountTechnology (SMT) components 15-35cm in size.
8. This machine has 540W heating system , widely to 120mm*120mm.
9. Preheating plate color is black ,from the photics point of view, black color easy to absorb heating, shorten the warm-up time.
10. Powerful human function design, with the following functions:
A. Temperature correction function : Correction of temperature range:-50°C~+50 °C(Infrared lamp analog value :580).
B. Celsius / Fahrenheit temperature display function
11. This machine also have hot air reworks and soldering iron function, if you have the device ,you can used for all of the components solder ,de-soldering ,preheating ,repair all components ,especially Micro BGA components.
Technical data:
voltage AC220V±10%
Max power consumption 1415W
Preheating station parts:
Max power consumption:540W
Light-emitting components:Far infrared heating plate
Temperature Range:50°C-300°C/122°F~572°F or 50 °C ~200 °C / 122°F~488°F
Display Type:LED
Preheating area:120*120mm
Infrared lamp part:
Max power consumption:150W
Light-emitting components:Infrared emission lamp
Temperature Range:100°C-350°C/212°F~662°F
Temperature Stability:±1°C
Display Type:LED
Effective irradiation area:35*35mm
Come with 2 lens cup, you can be choice two of lens cup from 28mm / 38mm /48mm.
Soldering station part:
Max power consumption:75W
Heating components:imported heater
Temperature Range:200°C-480°C/392°F~896°F
Temperature Stability:±1°C(statics)
Tip of ground voltage:<2mV
Tip ground impedance:<2 ohm
Display Type:LED Display
Handle cable length;≥100cm
Hot Air Reworks part:
Max power consumption:700W
Heating components:Skeleton-type ceramic heater
Airflow type:Brushless fan spiral wind
Air Flow:≤130 L/min
Temperature Range:100°C-480°C/212°F~896°F
Temperature Stability:±1°C(statics)
Display Type:LED
Handle cable length:≥100cm
Operation infrared BGA rework station NOTICE:
1.Repair circuit boards required precautions and necessary protective measures:
1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components,like:Plastic,Display,Phone camera,LED,Electrolytic capacitors.
2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If you can not avoid,Must use reflective paper keep out that. like:Plastic,Display,Phone camera,LED,Electrolytic capacitors.
2.According to IC size, use a suitable diameter lamp cup(lamp cup size larger than IC size);Install lights Cup minimize the distance between lamp and IC,to facilitates heating.
3. Ensure that the working environment is no greater airflow to prevent heat loss,well sheltered measures when necessary.
4. Apply solder paste to the IC before the de-soldering,also you can early preheat then Apply solder paste,Especially BGA package IC,should be early preheat then apply solder paste,the can make solder paste penetrate into the bottom of the IC.
5. Wear heat protective gloves and goggles. Place the visor, good shading measures to protect the eyes.
6. Turn on the Infrared light power,Set the temperature to about 280°C.Make the appropriate adjustments based on the siz