Thickness: 1.6mm
Control chips: 14
Application: LED
Minimum trace size: 0.1mm
Minimum drill: 0.15mm
Blind and burried holes

Product capability:

Layers: 1 to 22

Board finished thicknesses: 0.2 to 7.0mm

Materials: FR-4, CEM-3, high TG, halogen-free FR4 and Rogers

Maximum finished board sizes: 580 x 900mm
Minimum hole size: 4mil (0.1mm)
Min trace width/space: 3.5mil/3.5mil
Copper thickness: 0.5 to 6oz
Copper thickness in hole: >18um
Inner packing: vacuum packing/plastic bag
Outline tolerance: ±0.13mm
Hole size tolerance: <ul>
PTH: ±0.076mm
NPTH: ±0.05mm</ul>
With UL and TS16949:2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering, gold finger
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products