Item

Capability

1.Base Material

FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC

2.Layers

1-30

3.Finised inner/outer copper thickness

1-12OZ

4.Finished board thickness

0.2-7.0mm

Tolerance

Board thickness≤1.0mm: 0.1mm

1<Board thickness≤2.0mm: 10%

Board thickness>2.0mm: 8%

5.Max panel size

≤2sidesPCB: 600*1500mm

Multilayer PCB: 500*1200mm

6.Min conductor line width/spacing

Inner layers: ≥3/3mil

Outer layers: ≥3.5/3.5mil

7.Min hole size

Mechanical hole: 0.15mm

Laser hole: 0.1mm

Drilling precision: first drilling

First drilling: 1mil

Second drilling: 4mil

8.Warpage

Board thickness≤0.79mm: β≤1.0%

0.80≤Board thickness≤2.4mm: β≤0.7%

Board thickness≥2.5mm: β≤0.5%

9.Controlled Impedance

5%

10. Aspect Ratio

15:1

11.Min welding ring

4mil

12.Min solder mask bridge

≥0.08mm

13.Plugging vias capability

0.2-0.8mm

14. Hole tolerance

PTH: 3mil

NPTH: 2mil

15.Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

16.Surface treatment

OSP: 0.5-0.5um

HASL: 2-40um

Lead free HASL: 2-40um

ENIG: Au 1-10U’’

ENEPIG: PB 2-5U’’/ Au 1-8U’’

Immersion Tin:0.8-1.2um

Immersion silver: 0.1-1.2um

Peelable blue mask

Carbon ink

Gold plating: Au 1-150U’’

17. E-testing pass percent

97% pass for the first time,2%(tolerance)

FQC-Physical Lab: Reliability tests

18.Certificate

ROHS UL ISO9001:2008 IPC SGS

19.Other technology capacity that we can according your design to changed.

Our equipments

1.Drilling workshop