Features: 1) Layers: 1 to 12 2) Base materials: BT, Kapton, G10, FR4, CEM-3 3) Base copper thickness: 1/3 oz. to 3 oz. 4) Double sided: 0.10mm/0.004 inch 5) Four layers: 0.40mm/0.016 inch 6) Six layers: 0.55mm/0.022 inch 7) Max. panel size: 250 x 400mm 8) Min. hole diameter: 0.10mm 9) PTH hole tolerance: 0.05mm/0.002 inch 10) Aspect ratio: 6:1 11) Blind or buried via: yes 12) Min. line width: 0.051mm/0.002 inch 13) Min. line spacing: 0.051mm/0.002 inch 14) Min. bonding pitch: 0.181mm/0.007 inch (center to center) 15) Min. SMT pitch: 0.40mm/0.016 inch (center to center) 16) Min. hole registration tolerance (NPTH): ± 0.025mm 17) Min. hole registration tolerance (PTH): ± 0.075mm 18) Min. pattern registration tolerance: ± 0.05mm 19) Min. S/M registration tolerance (LPI): ± 0.075mm 20) Min. annular ring: ± 0.025mm 21) Min. S/M bridge (LPI): 0.1mm 22) Plated gold thickness: 0.025um - 3um