.Materials: XPC, XXXPC, FR-2, CEM-1, CEM-2, CEM-3 .Board thickness: 0.32mm to 2.4mm .Copper thickness: 70um (2oz), 35um (1oz), 18um (0.5oz) .Finishings: Bare copper with flux Gold plating Nickel plating Carbon printing .Patterns: Min conductor width: 0.10mm (4 mils) Min conductor spacing: 0.15mm (6 mils) Min pad diameter: 1.50mm Min hole diameter: 0.80mm (punching) Min hole diameter: 0.50mm (CNC drilling) .Carbon: Coverage: 2.5 meter square at 10u Sheet resistance: 15 ohms/meter square at 25u .Max. board size: 570(L) x 445(W)mm .Image develop: Silk-screen, wet film .Solder mask curing: IR, UV, wet film .Holes processing: Punching, CNC drilling and routing .Outline fabrication: Punching, CNC routing, V-cut, push-back and panel form