FR-4,4/4 Mil, Flashgold,0.3 mm Hole Size, BGA Pad STACI PCB capabilities: - Rigid Boards from 1 to 18 layers, Flex Circuits from 1 to 4 layers - HAL, Flash Gold, Immersion Gold, Gold Finger Plating, Selective Gold Plating, Entek Finish, Immersion Tin, and Lead free HASL - Silver Ink Through Holes, Silver and Carbon Ink Jumper, Carbon Printing, Peelable Solder Mask - Materials: CEM-1, CEM-3, FR-1, FR-2, FR-4, FR-5 (High Tg), High Tg Material (Tg = 180 degrees C), BT, Rogers, G-Tek, Polyamide, Ceramic Material - Board Thickness:0.1 mm to 3.4 mm - Thickness of Copper: Outer layer:0.5 oz to 12 oz, inner layer 4oz - Hole Size:0.25 mm minimum - Trace Width:0.076 mm minimum (3 mil) - Trace Spacing:0.076 mm minimum (3 mil) - Impedance Control: +/- 10% - Aspect Ratio:10:1