Features: 1) Process range: a) Wafer: i) Diameter: 4.0 - 100mm ii) Thickness: 0.1 – 15mm b) Circular tube: i) Diameter: 5.0 – 100mm ii) Wall thickness: 1 – 10mm iii) Height: 2.5 – 50mm c) Sphere: i) Diameter: 5 –40mm ii) Wall thickness: 0.5 –3mm iii) Caliber: 5 –8mm d) Circular ring: i) Excircle diameter: 5.0 – 100mm ii) Inner circle: dia. (2.0 – 35mm), T (0.2 - 15mm) e) Column: dia. (2.0 – 20mm), T (2.5 –30mm) f) Rectangular plate dimensions: (2 – 130) x (2 – 50) x (0.15 – 20) mm 2) Applications: ultrasonic atomizers, ultrasonic cleanings, ultrasonic weldings, and medical equipment