Ceramic bond Diamond grinding wheel have characteristics of sharp cutting, high efficiency, long life, less heat and blocking generated, easy control the precision and easy dressing.
Application:
Ceramic bond diamond grinding wheels: Mainly used for machining tungsten carbide, ceramic, cermets, optics materials, PCD, PCBN, CVD, natural diamond, stones and so on.
Diameters: φ25—750mm
Thickness: 5-300mm
Grit: 60/70~W3.5
Concentration: 25, 50, 75, 100, 125, 150
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