Feature:
1.The machine is designed for punching the single IC chips from the IC Module tape after the hot melt glue is pressed to the IC module bottom side.
2.High automation and humanization design,the machine runs stable,easy for operation and adjustment.
3.Adopting precise punching module,and cylinder control the punching module ensure the punching quality.
4.Punching module can be change flexible ,applicable to different production processes.
5.Automatic recording for module punching number is available.
6.The machine operate the punching process automatically, low noise during the process.
7.Long life space of the punching module,each module can punch up to 20,000 times.
8.Equipped with finished product collection device,easy for operation and adjustment.
Machine Spec:
1.Speed: 7200 pcs /h
2.Dimension: L1300×W340×H1400mm
3.Weight: 100 KG
4.Power supply: AC220V 50/60HZ
5.Material spec: various contact and contactless chip
6.Operator:1 person
7.Punching Module Life Space:20,000 times
LDT-ICP-400 Automatic IC Punching Machine
| Brand Name | LDT |
| Place of Origin | China |
| Model Number | LDT-ICP-400 |
| After-sales Service Provided | Engineers available to service machinery overseas |
| Weight | 100 KG |
| Voltage | AC220V 50/60HZ |
| Usage | Other, punching machine |
| Condition | New |
| Automatic Grade | Automatic |
| Dimensions(L*W*H) | L1300*W340*H1400mm |
| Color & Page | Multicolor |
| Plate Type | Other |
Product Features
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