This product is a room temperature / heating curing additive silicone material, consisting of two components A and B. This two-component elastomeric silicone is designed for potting and protection of electronic products in harsh conditions. When the two components are mixed in a 1: 1 weight ratio or volume ratio, the mixed liquid will solidify into a flexible elastomer. This product is suitable for potting and sealing of electrical / electronic products. The duration of application and the curing time at room temperature are independent of the number of materials. There was no obvious shrinkage and temperature rise during curing. Rubber material is no toxin, no corrosion; fully cured material has UV resistance, anti-aging performance, repairability and excellent weather resistance.
Performance features
● Excellent weather resistance, can be used for a long time outdoor
●Do not corrode metal and circuit boards
● Excellent temperature resistance, electrical properties, insulation properties, and flexibility
●Disassembled, sealed components can be removed for repair and replacement, and then use the potting silicone to repair without traces
●Good liquidity makes it can be fast self-leveling, and automatic irrigation equipments lead high production efficiency
●Good anti-poisoning performance, applicable for general lead circuit board, flux and rubber seal potting
●Good thermal conductivity and low thermal resistance, good flame retardancy
Main effects
For electronic appliances, drive power, circuit board potting and sealing.
Technical performances
Conventional performance
Items | Testing standard | Unit | A component | B component |
Color | Visual | --- | White/Light gray | White |
Visocity | GB/T 2797-1995 | mPa·s（25℃） | 1800±400 | 1800±400 |
density | GB/T 13354-92 | g/cm3（25℃） | 1.65±0.05 | 1.65±0.05 |
Operation process
Items | Unit/Condition | Numerical value |
Mx ratio | ratio | 1︰1 |
Visocity | mPa·s（25℃） | 1800±400 |
Density | g/cm3（25℃） | 1.65±0.05 |
Operating period | mins（25℃） | 60～90 |
Surface dry time | (with finger ) mins（25℃） | 80～120 |
Solidification time | Hr/℃ | 0.5/60 or 10/25 |
Color after solidification | visual | light gray |
Preparing A, B, the two components in definition proportion, then mixing evenly, removing the bubbles in the vacuum, pouring it into the potting products within the operation period.As for the large potting products, sub-potting is recommended.）
Typical performances
Items | Testing standard | Unit | Numerical value |
Hardness | GB/T 531-83 | Shore A | 55±5 |
Thermal conductive | GB/T 10297-1998 | W/mK | 0.8 |
Expansion coefficient | GB/T 20673-2006 | μm/（m，℃） | 200 |
Dielectric constant | GB/T 1693-2007 | (1MHz 25℃) | 3.0 |
Loss factor (1MHz) | GB/T 1693-2007 | （1MHz 25℃） | 0.01 |
Dielectric strength | GB/T 1698-2005 | kV/mm（25℃） | >20.9 |
Temperature resistance | ℃ | -50～200 | |
Elongation | GB/T 528 | % | 80 |
Volume resistivity | GB/T 1410-2006 | （DC500V）Ω· cm | 1.0×1014 |
Rank of flame retardancy | UL-94 | 3mm，105℃ | V-0 |
