Specifications
a.thermal conductivity:
1400-1500W/(mK) - x/y direction
15W/(mK) - z direction
b.Bulk density:1.3-1.7g/cc
1.Introduction:
As electronic devices continue to be more powerful features integrated into smaller and smaller component, the temperature control has become one of the crucial challenges in the design.
The operating space is getting smaller and smaller, how to effectively take away more heat generated by the larger unit power, has become a very important topic. So chip makers are more concerned on the technology of heat conducting and how to take away the waste heat. These heat always takes effect on component stability and longevity. As we all know, the operating temperature has a tremendous effect on the junction circuit . If the temperature is slightly lower (10-15 )centigrade, the equipment spanlife will be triple. And the lower operating temperature can also reduce the signal delay, which help to improve the processing speed.In addition, lower temperatures can reduce the idle power dissipation to reduce the total power dissipation.
customers in the filed of electronics industry, as for noteblook computers, LCD, Mobile phones and other modern high-tech electronic products, will be interested in our this product very much.
2.Charaters
It has great advantages compared with metal material:
1.good thermal conductivity
2.Density is low, weight is less
Just compare with copper whose density is 8.9g/cm3, our product density is around 1/4 of it.
3.Low cost.