Model:

SYJ-160 Low Speed Diamond Saw

Brief Introduction:

SYJ-160 Low Speed Diamond Saw  is specialized  designed to material researchers, the products sells to research institutes, universities and  research department of famous companies, small and medium-sized companies for the relevant material analysis. Many artificial crystal precision cutting also can use this machine.

Main

Feature:

Used for precision cutting the material sample, high torque, running steady, can cut all kinds of materials and the thickness are 0.1mm. Suitable for samples' follow-up thinning, polishing and various operation.

The different between SYJ-160 and SYJ-150 is the former can use various blades of 150mm(outside diameter). It's good for cutting bigger samples.  Original equips with digital micrometer.

Technical

Parameter:

1. Speed range:20-600RPM stepless speed adjust

2. Voltage:AC 110V/220V
3. Position accuracy:0.01mm( Mechanical and digital display )
4. Two dimension, angle adjustment: 360(H),(+/-)15(V)
5. Max. travel distance:50mm(Fine adjustment travel distance 25mm)
6. Max dia. wafer blade:150mm(6 inches)
7. Automatic shut off:allowed unattended
8. Digital display axis RPM

Specification:

Size:400 x300 x30mm  Weight:14.5kg

Standard Accessories:

Optional Accessories :

1. Edge sintered Diamond Blade:Φ150x12.7x0.55                             
2. Full sintered Diamond Blade:Φ150x12.7x0.50                                   
3. Sic blade:Φ150x12.7x0.55                                                                
4. Al₂O₃ blade:Φ150x12.7x0.55                                                             

5. Electroplating diamond blade:Φ150x12.7x0.40                                 

6. (Optional)All kinds of blades:Φ100x12.7x0.4